DocumentCode
1090534
Title
Design of Vertically Stacked Waveguide Filters in LTCC
Author
Shen, Tze-Min ; Chen, Chi-Feng ; Huang, Ting-Yi ; Wu, Ruey-Beei
Author_Institution
Nat. Taiwan Univ., Taipei
Volume
55
Issue
8
fYear
2007
Firstpage
1771
Lastpage
1779
Abstract
This paper proposes four-pole quasi-elliptic function bandpass waveguide filters using multilayer low-temperature co-fired ceramic technology. The vertical metal walls of the waveguide resonators are realized by closely spaced metallic vias. Adjacent cavities are coupled by a narrow slot at the edge of the common broad wall or an inductive window on the sidewall. Two types of vertical coupling structures are utilized to achieve the cross coupling between nonadjacent resonators at different layers. With multilayer capability, there is more flexibility to arrange the cavities of coupled resonator filters in 3-D space. It is demonstrated by both the simulation and experiment that the proposed filter structures occupy a compact circuit area and have good selectivity. The filter with electric field cross coupling occupies a half area of a planar four-pole waveguide filter, while the filter with stacked vias cross coupling has 65% size reduction in comparison with a planar waveguide filter.
Keywords
band-pass filters; cavity resonator filters; ceramic packaging; elliptic filters; waveguide filters; LTCC; adjacent cavities; coupled resonator filters; four-pole quasi-elliptic function bandpass waveguide filters; inductive window; metallic vias; multilayer low-temperature co-fired ceramic technology; vertical coupling structures; vertical metal walls; vertically stacked waveguide filters; waveguide resonators; Band pass filters; Ceramics; Coupling circuits; Frequency; Microwave filters; Millimeter wave technology; Nonhomogeneous media; Planar waveguides; Resonator filters; Space technology; Bandpass filter; cavity; coupling coefficient; low-temperature co-fired ceramic (LTCC); quasi-elliptic function; stacked vias;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2007.902080
Filename
4287182
Link To Document