DocumentCode :
1091073
Title :
News Briefs
Author :
Paulson, Linda Dailey
Volume :
40
Issue :
7
fYear :
2007
fDate :
7/1/2007 12:00:00 AM
Firstpage :
17
Lastpage :
19
Abstract :
IBM researchers have developed a technique that creates vacuum spaces, called airgaps, between the wires in processors using self-assembling technology. These airgaps create a form of insulation that increases the chips´ performance up to 35 percent or reduces their power consumption up to 15 percent. The airgap technique lowers the chip insulator´s dielectric constant, which describes a material´s ability to transmit charge when a voltage is applied. Because the insulator would transmit less charge, the current introduced to other circuits would drop. Vacuums are very good insulators because they don´t transmit charge well. Using airgaps between wires can lower a chip insulator´s relative dielectric level to a bit below 2.0.
Keywords :
insulation; microprocessor chips; permittivity; self-assembly; IBM; airgap; chip insulator dielectric constant; chip performance; power consumption; processor chip; self-assembling technology; vacuum space; wire; Cable insulation; Circuits; Computer hacking; Dielectric constant; Dielectrics and electrical insulation; Energy consumption; Lithography; Transistors; Vacuum technology; Wires; Wi-Fi; airgap technology; eye-tracking technology; malware;
fLanguage :
English
Journal_Title :
Computer
Publisher :
ieee
ISSN :
0018-9162
Type :
jour
DOI :
10.1109/MC.2007.249
Filename :
4287236
Link To Document :
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