DocumentCode
1091151
Title
Temperature Control and In Situ Fault Detection of Wafer Warpage
Author
Ho, Weng Khuen ; Yap, Christopher ; Tay, Arthur ; Chen, Wei ; Zhou, Ying ; Tan, Woei Wan ; Chen, Ming
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore
Volume
20
Issue
1
fYear
2007
Firstpage
1
Lastpage
4
Abstract
Warped wafers can affect device performance, reliability, and linewidth control in various processing steps. We propose in this paper an in situ fault detection technique for wafer warpage in lithography. The use of advanced process control results in very small temperature disturbance making it suitable for industrial implementation
Keywords
fault diagnosis; integrated circuit manufacture; lithography; process control; signal detection; temperature control; fault detection; lithography; process control; temperature control; wafer warpage; Air gaps; Computational modeling; Computer simulation; Feedback control; Industrial control; Linear programming; Optimal control; Pi control; Semiconductor device modeling; Temperature control; Fault detection; lithography; temperature measurement; wafer warpage;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2006.890314
Filename
4089019
Link To Document