• DocumentCode
    1092339
  • Title

    Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors

  • Author

    Fung, Carmen K M ; Wong, Victor T S ; Chan, Rosa H M ; Li, Wen J.

  • Author_Institution
    Centre for Micro & Nano Syst., Chinese Univ. of Hong Kong, China
  • Volume
    3
  • Issue
    3
  • fYear
    2004
  • Firstpage
    395
  • Lastpage
    403
  • Abstract
    We present a feasible technology for batch assembly of carbon nanotube (CNT) devices by utilizing ac electrophoretic technique to manipulate multiwalled bundles on an Si/SiO2 substrate. Based on this technique, CNTs were successfully and repeatably manipulated between microfabricated electrodes. By using this parallel assembly process, we have investigated the possibility of batch fabricating functional CNT devices when an ac electrical field is applied to an array of microelectrodes that are electrically connected together. Preliminary experimental results showed that over 70% of CNT functional devices can be assembled successfully using our technique, which is considered to be a good yield for nanodevices manufacturing. Besides, the devices were demonstrated to potentially serve as novel thermal sensors with low power consumption (∼microwatts) with electronic circuit response of approximately 100 kHz in constant current mode operation. In this paper, we will present the fabrication process of this feasible batch manufacturable method for functional CNT-based thermal sensors, which will dramatically reduce production costs and production time of nanosensing devices and potentially enable fully automated assembly of CNT-based devices. Experimental results from the thermal sensors fabricated by this batch process will also be discussed.
  • Keywords
    batch processing (industrial); carbon nanotubes; chip scale packaging; electrophoretic coating techniques; gold; integrated circuit manufacture; microelectrodes; nanoelectronics; nanolithography; nanotube devices; power consumption; temperature sensors; 100 kHz; Au; C; Si-SiO2; Si/SiO2 substrate; ac electrical field; ac electrophoretic technique; bundled carbon nanotube thermal sensors; constant current mode operation; dielectrophoretic batch fabrication; electronic circuit response; low power consumption; microfabricated electrodes array; multiwalled bundles; nanodevices manufacture; nanosensing devices; parallel assembly process; production cost reduction; Assembly; Carbon nanotubes; Dielectrophoresis; Electrodes; Fabrication; Manufacturing; Microelectrodes; Nanoscale devices; Production; Thermal sensors; AC electrophoretic manipulation; CNT; CNT sensors; carbon nanotube; nano batch fabrication; nanomanufacturing;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1536-125X
  • Type

    jour

  • DOI
    10.1109/TNANO.2004.834156
  • Filename
    1331330