Title :
VLSI Implementation of a High-Throughput Iterative Fixed-Complexity Sphere Decoder
Author :
Xi Chen ; Guanghui He ; Jun Ma
Author_Institution :
Sch. of Microelectron., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
By exchanging soft information between the multiple-input multiple-output (MIMO) detector and the channel decoder, an iterative receiver can significantly improve the performance compared to the noniterative receiver. In this brief, a soft-input soft-output fixed-complexity-sphere-decoding algorithm and its very large scale integration architecture are proposed for the iterative MIMO receiver. The deeply pipelined architecture employs the optimized hybrid enumeration to search for the best child node estimate efficiently. By adding the counter hypotheses in parallel with other candidates, the proposed iterative MIMO detector improves the detection performance significantly with low detection latency. An iterative detector for an 4 × 4 64-quadrature amplitude modulation (QAM) MIMO system based on our proposed architecture is designed and implemented using the 90-nm CMOS technology. The detector can achieve a maximum throughput of 2.2 Gbit/s with an area efficiency of 3.96 Mbit/s/kGE, which is more efficient than other iterative MIMO detectors.
Keywords :
CMOS integrated circuits; MIMO communication; VLSI; channel coding; iterative decoding; quadrature amplitude modulation; radio receivers; 64-QAM MIMO system; 64-quadrature amplitude modulation MIMO system; CMOS technology; VLSI implementation; bit rate 2.2 Gbit/s; bit rate 3.96 Mbit/s; channel decoder; high-throughput iterative fixed-complexity sphere decoder; iterative MIMO detector; iterative MIMO receiver; multiple-input multiple-output detector; noniterative receiver; optimized hybrid enumeration; size 90 nm; soft-input soft-output fixed-complexity-sphere-decoding algorithm; Fixed-complexity sphere decoding (SD) (FSD); multiple-input multiple-output (MIMO); soft-input soft-output (SISO) MIMO detection; very large scale integration (VLSI);
Journal_Title :
Circuits and Systems II: Express Briefs, IEEE Transactions on
DOI :
10.1109/TCSII.2013.2251954