• DocumentCode
    1094364
  • Title

    Wire Optimization for Multimedia SoC and SiP Designs

  • Author

    Lee, Jaesung ; Lee, Hyuk-Jae

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul
  • Volume
    55
  • Issue
    8
  • fYear
    2008
  • Firstpage
    2202
  • Lastpage
    2215
  • Abstract
    With advances in VLSI integration technology, a large number of hardware components can be integrated into a single chip. To provide the communication bandwidth for these components, existing bus-based interconnects often suffer from a large area occupied by a large number of bus signals. To address this issue, this paper proposes a new protocol for on-chip or in-package communication that is termed the system-on-chip network protocol (SNP). SNP uses a small number of signals that are shared by address, control, and data information. Additional three-bit phase signals are used to distinguish the different information transmitted through a single set of SNP signals. Two sets of identical SNP signals form a symmetric communication channel that allow a master-to-master type of communication between hardware components. The phase signals facilitate the reduction of the communication time with phase interleaving and phase omission-restoration among successive transactions. The efficiency of SNP is evaluated by a static performance analysis as well as by simulations with register-transfer level models of SNP components. Both the analysis and simulation results show that the communication time with SNP is approximately a half that of advanced microcontroller bus architecture advanced high-performance bus (AHB), although SNP has wires that are approximately three-fifths of AHB. MPEG-4 chips are implemented with both AHB and SNP, respectively, and it is observed from the MPEG-4 implementations that SNP requires less area for communication compared to AHB.
  • Keywords
    VLSI; field buses; multimedia systems; system-in-package; system-on-chip; SNP; SiP designs; VLSI integration technology; advanced high-performance bus; advanced microcontroller bus architecture; bus-based interconnects; in-package communication; multimedia SoC; on-chip communication; phase interleaving; phase omission-restoration; symmetric communication channel; system-on-chip network protocol; three-bit phase signals; wire optimization; Multimedia system-on-chip (SoC); SNP; SiP; SoC; SoC Network Protocol (SNP); VLSI design; multimedia SoC; on-chip bus; system-in-package (SiP); wire efficiency;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems I: Regular Papers, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1549-8328
  • Type

    jour

  • DOI
    10.1109/TCSI.2008.920153
  • Filename
    4468693