DocumentCode
1094879
Title
An analysis of two-heater active thermal control technology for device class testing
Author
Wan, J.W. ; Zhang, W.J. ; Torvi, David ; Wu, F.X.
Author_Institution
Dept. of Mech. Eng., Univ. of Saskatchewan, Saskatoon, Sask., Canada
Volume
27
Issue
3
fYear
2004
Firstpage
577
Lastpage
584
Abstract
A novel technology for controlling temperature rise in the class testing is described in this article. This technology is based on two active heater sources and is called a two-heater active thermal control (2H-ATC) system. From a point of control, a lumped analytical model for representing the whole class testing process is very important, and is developed in this article. The model was validated by comparing the simulated result with the measured result on a commercial tester. Based on this model, we have studied the issue of optimization of the performance of the testing process, in particular examining effects of test system parameters on system performance. We have also observed a concept called critical heater power, which is important in achieving a minimum overshoot at the transition from the preheating stage to the testing stage. The outcome of this study has already been applied in practical process control during the whole class testing.
Keywords
integrated circuit testing; temperature control; thermal management (packaging); 2H-ATC system; commercial tester; critical heater power; device class testing; die temperature rise; heat transfer; heater sources; lumped analytical model; maximum device power; minimum overshoot; performance optimization; preheating stage; process control; system performance; temperature rise control; test system parameters; testing process; testing stage; thermal testing; two-heater active thermal control; Analytical models; Circuit testing; Control systems; Heat sinks; Heat transfer; Mechanical engineering; System testing; Temperature control; Temperature dependence; Thermal conductivity; 2H-ATC; Active thermal control; critical heater power; die temperature rise; heat transfer; maximum device power; system; thermal testing; two-heater active thermal control;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2004.831820
Filename
1331555
Link To Document