• DocumentCode
    1094921
  • Title

    Arrhenius average temperature: the effective temperature for non-fatigue wearout and long term reliability in variable thermal conditions and climates

  • Author

    Tencer, Michal ; Moss, John Seaborn ; Zapach, Trevor

  • Author_Institution
    Nortel Networks, Ottawa, Ont., Canada
  • Volume
    27
  • Issue
    3
  • fYear
    2004
  • Firstpage
    602
  • Lastpage
    607
  • Abstract
    This paper presents a method of assessing the effective temperature essential for predicting the temperature acceleration of the wearout mechanisms (other than thermal fatigue) of electronic equipment. This is particularly important for equipment experiencing variable thermal conditions. The approach, based on weighting of thermal acceleration factors, leads to the Arrhenius average temperature Teff given by (4). Teff is related to wearout processes and allows one to compare predictions from the thermal design to results of accelerated testing. It has no relation to the maximum component temperature which influences functionality. The method is applicable to outside plant telecommunication equipment as well as in the automotive and aerospace industries. The effect of climate and design constraints on Teff are discussed.
  • Keywords
    electronic equipment testing; electronics packaging; environmental factors; reliability; temperature measurement; thermal management (packaging); Arrhenius average temperature; accelerated testing; aerospace industry; automotive industry; climate condition; effective temperature; electronic equipment; nonfatigue wearout; plant telecommunication equipment; reliability; temperature acceleration; thermal acceleration factors; thermal condition; thermal design; thermal fatigue; wearout mechanisms; Acceleration; Aerospace industry; Automotive engineering; Electronic equipment; Failure analysis; Fatigue; Helium; Life estimation; Temperature dependence; Thermal factors; Arrhenius average temperature; thermal acceleration factors; thermal fatigue;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.831834
  • Filename
    1331558