DocumentCode :
1094952
Title :
How China is closing the semiconductor technology gap
Author :
Pecht, Michael G.
Author_Institution :
Mech. Eng. Dept., Univ. of Maryland, College Park, MD, USA
Volume :
27
Issue :
3
fYear :
2004
Firstpage :
616
Lastpage :
619
Abstract :
China has been obtaining and advancing technology in a manner and at a pace that has surprised most people. The high-tech semiconductor industry exemplifies this growth. In less than 10 years China went from being five generations behind in integrated circuit (IC) semiconductor processing, to being current with the state-of-the-art. With the help of Chinese engineers, often educated by U.S. companies including Motorola and Intel, Chinese companies will soon be producing the leading IC technologies for the world. With the already existing infrastructure to incorporate semiconductors into advanced systems, and a large internal (and external) market, China´s future truly looks bright.
Keywords :
consumer products; integrated circuit manufacture; integrated circuit technology; semiconductor device manufacture; semiconductor technology; technological forecasting; technology transfer; China; Intel; Motorola; US companies; consumer product manufacturing; integrated circuit semiconductor processing; semiconductor industry; semiconductor technology; Aerospace electronics; Consumer electronics; Costs; Electronics industry; Integrated circuit technology; Military aircraft; Printers; Research and development; Semiconductor device manufacture; Semiconductor lasers; China; R&D; export policy; semiconductor;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2004.834952
Filename :
1331560
Link To Document :
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