IIB-3 aluminum alloys with titanium, tungsten, and copper for multilayer interconnections

Author

Gardner, D. ; Michalka, Tim ; Saraswat, Krishna ; McVittie, J. ; Barbee, T. ; Meindl, J.

Volume

Issue

fYear

1984

fDate

12/1/1984 12:00:00 AM

Firstpage

1965

Lastpage

1965

Keywords

Aluminum alloys; Annealing; Conductivity; Copper; Electromigration; Nonhomogeneous media; Rough surfaces; Surface roughness; Titanium; Tungsten;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

DOI

10.1109/T-ED.1984.21835

Filename

1484120

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