DocumentCode :
1095089
Title :
X-radiation response of SIMOX buried oxides: influence of the fabrication process
Author :
Paillet, P. ; Autran, J.L. ; Flament, O. ; Leray, J.L. ; Aspar, B. ; Auberton-Herve, A.J.
Author_Institution :
CEA, Centre d´´Etudes de Bruyeres-le-Chatel, France
Volume :
43
Issue :
3
fYear :
1996
fDate :
6/1/1996 12:00:00 AM
Firstpage :
821
Lastpage :
825
Abstract :
X-ray induced electron and hole trapping properties have been investigated in SIMOX buried oxides of different processes, including standard and supplemental implantation oxides, as well as new thin and ultra-thin oxides. The effect of the substrate bias applied during irradiation is studied, and then used to extract both hole and electron trapping parameters. The results demonstrate that varying the oxygen implantation conditions has very little effect on the radiation induced behavior of the material. They show that the charge trapping properties of the buried oxide are related to the ultra high temperature anneal performed on the confined oxide layer, and confirm that the post implantation anneal is the most critical part of the SIMOX process
Keywords :
SIMOX; X-ray effects; annealing; buried layers; dielectric thin films; electron traps; hole traps; integrated circuit technology; ion implantation; O implantation conditions; SIMOX buried oxides; Si-SiO2; X-radiation response; X-ray induced trapping properties; electron trapping properties; fabrication process influence; hole trapping properties; post implantation anneal; standard implantation oxides; substrate bias; supplemental implantation oxides; thin oxides; trapping parameters extraction; ultra high temperature anneal; ultrathin oxides; Annealing; Argon; Charge carrier processes; Electron traps; Fabrication; Implants; Low voltage; Manufacturing; Silicon on insulator technology; Temperature;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.510719
Filename :
510719
Link To Document :
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