DocumentCode
1095096
Title
Printed circuit board recycling: a state-of-the-art survey
Author
Li, Jianzhi ; Shrivastava, Puneet ; Gao, Zong ; Zhang, Hong-Chao
Author_Institution
Ind. Eng. Dept., Texas Tech Univ., Lubbock, TX, USA
Volume
27
Issue
1
fYear
2004
Firstpage
33
Lastpage
42
Abstract
This survey is done with an intention of providing a clear and comprehensive review of current practices and recent developments in the area of printed circuit board (PCB) recycling. The aim of this paper is to be a reference for research and implementation for the PCB recycling process. Original information is collected from the companies engaged in the PCB recycling industry and articles published after 1990. The paper gives an overview of the PCB structure, material composition and different recycling processes.
Keywords
printed circuits; recycling; PCB demanufacturing; PCB material composition; PCB recycling; PCB structure; electronic product disassembly; end-of-life; printed circuit board; Consumer electronics; Copper; Epoxy resins; Etching; Flame retardants; Humans; Laminates; Manufacturing; Printed circuits; Recycling; Demanufacturing; PCB; electronic product disassembly; end-of-life; printed circuit boards; recycling;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2004.830501
Filename
1331573
Link To Document