Title :
Printed circuit board recycling: a state-of-the-art survey
Author :
Li, Jianzhi ; Shrivastava, Puneet ; Gao, Zong ; Zhang, Hong-Chao
Author_Institution :
Ind. Eng. Dept., Texas Tech Univ., Lubbock, TX, USA
Abstract :
This survey is done with an intention of providing a clear and comprehensive review of current practices and recent developments in the area of printed circuit board (PCB) recycling. The aim of this paper is to be a reference for research and implementation for the PCB recycling process. Original information is collected from the companies engaged in the PCB recycling industry and articles published after 1990. The paper gives an overview of the PCB structure, material composition and different recycling processes.
Keywords :
printed circuits; recycling; PCB demanufacturing; PCB material composition; PCB recycling; PCB structure; electronic product disassembly; end-of-life; printed circuit board; Consumer electronics; Copper; Epoxy resins; Etching; Flame retardants; Humans; Laminates; Manufacturing; Printed circuits; Recycling; Demanufacturing; PCB; electronic product disassembly; end-of-life; printed circuit boards; recycling;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2004.830501
