• DocumentCode
    1095546
  • Title

    Commercial-Components Initiative: Ground Benign Systems-plastic encapsulated microcircuits

  • Author

    Kross, Edward J. ; Sicuranza, Michael A.

  • Author_Institution
    559 Union Ave., Framingham, MA, USA
  • Volume
    45
  • Issue
    2
  • fYear
    1996
  • fDate
    6/1/1996 12:00:00 AM
  • Firstpage
    180
  • Lastpage
    183
  • Abstract
    The purpose of the Commercial Components Initiative-Ground Benign Systems was to determine if commercial off-the-shelf PEM (plastic-encapsulated microcircuits) are suitable for use in ground-benign, dynamically-fixed military electronic systems. If so, they could replace the more expensive components presently specified by DoD (US Dept. of Defense), resulting in appreciable life-cycle cost savings. At issue is whether the components produced for the commercial industry are reliable and durable enough to withstand the environments and life expectancies of military systems. Reliability was not formally proven. A more practical informal reliability test for this project, which DSD dubbed Run for Reliability, was to install the PCB in the system and let the operational hours accrue beyond the subsystem and Signal Processor lifetime allocations. The Run for Reliability shows promise that commercial hardware could be proven in a formal reliability demonstration test
  • Keywords
    encapsulation; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; military equipment; plastic packaging; Commercial Components Initiative; Ground Benign Systems; IC reliability; Run for Reliability; USA; environments; formal reliability demonstration test; life expectancies; life-cycle cost; military electronic systems; plastic encapsulated microcircuits; Circuit testing; Consumer electronics; Costs; Electronic equipment manufacture; Hardware; Integrated circuit reliability; Laboratories; Plastics; Printed circuits; Radar;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.510799
  • Filename
    510799