DocumentCode
1095546
Title
Commercial-Components Initiative: Ground Benign Systems-plastic encapsulated microcircuits
Author
Kross, Edward J. ; Sicuranza, Michael A.
Author_Institution
559 Union Ave., Framingham, MA, USA
Volume
45
Issue
2
fYear
1996
fDate
6/1/1996 12:00:00 AM
Firstpage
180
Lastpage
183
Abstract
The purpose of the Commercial Components Initiative-Ground Benign Systems was to determine if commercial off-the-shelf PEM (plastic-encapsulated microcircuits) are suitable for use in ground-benign, dynamically-fixed military electronic systems. If so, they could replace the more expensive components presently specified by DoD (US Dept. of Defense), resulting in appreciable life-cycle cost savings. At issue is whether the components produced for the commercial industry are reliable and durable enough to withstand the environments and life expectancies of military systems. Reliability was not formally proven. A more practical informal reliability test for this project, which DSD dubbed Run for Reliability, was to install the PCB in the system and let the operational hours accrue beyond the subsystem and Signal Processor lifetime allocations. The Run for Reliability shows promise that commercial hardware could be proven in a formal reliability demonstration test
Keywords
encapsulation; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; military equipment; plastic packaging; Commercial Components Initiative; Ground Benign Systems; IC reliability; Run for Reliability; USA; environments; formal reliability demonstration test; life expectancies; life-cycle cost; military electronic systems; plastic encapsulated microcircuits; Circuit testing; Consumer electronics; Costs; Electronic equipment manufacture; Hardware; Integrated circuit reliability; Laboratories; Plastics; Printed circuits; Radar;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/24.510799
Filename
510799
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