DocumentCode :
1097192
Title :
Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly
Author :
Xie, Bin ; Shi, X.Q. ; Ding, Han
Author_Institution :
Adv. Electron. Manuf. Center, Shanghai Jiao Tong Univ., Shanghai
Volume :
31
Issue :
2
fYear :
2008
fDate :
6/1/2008 12:00:00 AM
Firstpage :
361
Lastpage :
369
Abstract :
In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues.
Keywords :
bonding processes; conductive adhesives; cracks; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; microassembling; stress analysis; anisotropic conductive adhesive assembly; bonding; cracked conductive particle; electrical characteristics; electrical conduction; glass substrate; integrated circuit; interconnection reliability; mathematical model; mechanical characteristics; metal coating; nickel coating; nickel-coated particle; numerical model; stress analysis; virtual resistance; Anisotropic conductive adhesive (ACA); cohesive element; finite element analysis (FEA); fracture analysis; mathematical model;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2008.916802
Filename :
4469972
Link To Document :
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