DocumentCode
109732
Title
Influence and mitigation of long differential via stub on signal integrity
Author
Jun Wang ; Jian-Min Lu ; Xiu-Qin Chu ; Yang Liu ; Xin-Quan Lai ; Yu-Shan Li
Author_Institution
Inst. of Electron. CAD, Xidian Univ., Xi´an, China
Volume
51
Issue
13
fYear
2015
fDate
6 25 2015
Firstpage
975
Lastpage
977
Abstract
How the long differential via stub influences the time-domain response and the eye diagram of the signal trace in a thick multilayer printed circuit board is investigated. Then, it is proved that RL termination has the same efficiency as R and RC terminations on improving signal integrity and the eye diagram. Finally, a method is proposed to mitigate the influence of the via stub by combining mismatched R termination and reflection gain at the receiving end.
Keywords
RC circuits; printed circuits; time-domain analysis; PCB; RC terminations; RL termination; SI; eye diagram; long differential via stub; reflection gain; signal integrity; signal trace; thick multilayer printed circuit board; time-domain response;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2015.0823
Filename
7130840
Link To Document