DocumentCode
1097391
Title
Improvement of mask-limited yield with a vote-taking lithographic scheme
Author
Fu, C.C. ; Dameron, D.H.
Author_Institution
Stanford Electronics Laboratories, Stanford, CA
Volume
5
Issue
10
fYear
1984
fDate
10/1/1984 12:00:00 AM
Firstpage
398
Lastpage
400
Abstract
A lithographic technique which can significantly reduce the effect of photomask defects is investigated. It is based on exposures of multiple reticle fields containing identical patterns, and is especially suitable for 1 × wafer steppers. The principle, requirements, and initial experimental results of this method are presented.
Keywords
Contamination; Geometry; Inspection; Integrated circuit technology; Integrated circuit yield; Lithography; Printing; Raw materials; Resists; Very large scale integration;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1984.25962
Filename
1484338
Link To Document