DocumentCode :
1098225
Title :
A comparison of systolic architectures for matrix multiplication
Author :
Lee, Hoon B. ; Grondin, Robert O.
Author_Institution :
Center for Solid State Electron. Res., Arizona State Univ., Tempe, AZ, USA
Volume :
23
Issue :
1
fYear :
1988
Firstpage :
285
Lastpage :
289
Abstract :
Systolic architectures for matrix multiplication are compared in terms of the maximum speedup which can be achieved with increased processor count in a monolithically integrated circuit. The comparison process integrates the architectural characteristics and the technological parameters. The optimum systolic architecture is found for different limiting factors including switching delay, power dissipation, I/O bandwidth, and clock skew. The interplay between limiting factors is studied through the implementation of an inner-product step processor using 3- mu m CMOS technology and its down-scaled version. For a given chip size and technology there is a critical level of heat extraction which separates a power-dissipation-limited case from a switching-delay limited case.<>
Keywords :
CMOS integrated circuits; computer architecture; microprocessor chips; 3 micron; CMOS technology; I/O bandwidth; architectural characteristics; chip size; clock skew; critical level; down-scaled version; heat extraction; increased processor count; inner-product step processor; limiting factors; matrix multiplication; maximum speedup; power dissipation; power-dissipation-limited case; switching delay; switching-delay limited case; systolic architectures; technological parameters; CMOS technology; Clocks; Computer architecture; Delay; Electrons; Integrated circuit interconnections; Monolithic integrated circuits; Optical fiber cables; Power dissipation; Very large scale integration;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/4.291
Filename :
291
Link To Document :
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