DocumentCode
1098731
Title
High-speed and large noise margin tolerance E/D logic gates with LDD structure DMTs fabricated using selective RIE technology
Author
Hida, Hikaru ; Tsukada, Yasutoshi ; Ogawa, Yumi ; Toyoshima, Hideo ; Fujii, Masahiro ; Shibahara, Kentaro ; Kohno, Michihisa ; Nozaki, Tadatoshi
Author_Institution
NEC Corp., Kanagawa, Japan
Volume
36
Issue
10
fYear
1989
fDate
10/1/1989 12:00:00 AM
Firstpage
2223
Lastpage
2230
Abstract
The authors describe a novel design concept for enhancement (E) and depletion (D) mode FET formation using i-AlGaAs/n-GaAs doped-channel hetero-MISFET (DMT) and a novel self-aligned gate process technology for submicrometer-gate DMT-LSIs based on E/D logic gates. 0.5-μm gate E-DMTs (D-DMTs) with a lightly doped drain (LDD) structure show an average V t of 0.18 (-0.46) V, a V t standard deviation of 22.6 (24.9) mV, and a maximum transconductance of 450 (300) mS/mm. The V t shift is less than 50 mV with a decrease in gate length down to 0.5 μm. The gate forward turn-on voltage V f is more than 0.9 V, i.e. about 1.6 times that for MESFETs. This superiority in V f, preserved in the high-temperature range, leads to an improvement in noise margin tolerance by a factor of three. In addition, 31-stage ring oscillators operate with a power consumption of 20 (1.0) mW/gate and a propagation delay of 4.8 (14.5) ps/gate. Circuit simulation based on the experimental data predicts 140 ps/gate and 1 mW/gate for DMT direct-coupled FET logic circuits under standard loading conditions. DMTs and the technology developed here are very attractive for realizing low-power and/or high speed LSIs
Keywords
III-V semiconductors; aluminium compounds; field effect integrated circuits; gallium arsenide; insulated gate field effect transistors; integrated circuit technology; large scale integration; logic gates; sputter etching; -0.46 V; 0.18 V; 0.5 micron; 1 mW; 14.5 ps; 20 mW; 300 mS; 31-stage ring oscillators; 4.8 ps; 450 mS; AlGaAs-GaAs; LDD structure; depletion mode FET; direct-coupled FET logic circuits; doped-channel hetero-MISFET; enhancement mode FET; gate forward turn-on voltage; gate length; high speed LSIs; large noise margin tolerance; logic gates; maximum transconductance; power consumption; propagation delay; selective RIE technology; self-aligned gate process technology; threshold voltage; Circuit noise; Energy consumption; FETs; Logic design; Logic gates; MESFETs; OFDM modulation; Ring oscillators; Transconductance; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.40903
Filename
40903
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