DocumentCode
1098863
Title
Performance limits of CMOS ULSI
Author
Pfiester, James R. ; Shott, John D. ; Meindl, James D.
Author_Institution
IBM Thomas J. Watson Research Center, Yorktown Heights, NY
Volume
32
Issue
2
fYear
1985
fDate
2/1/1985 12:00:00 AM
Firstpage
333
Lastpage
343
Abstract
An analytic MOST model has been developed to calculate accurately threshold voltage at submicrometer dimensions and to predict the scaling limits of digital CMOS circuits. Salient results show that for 2-V power-supply voltages, channel lengths as small as 0.14 µm for static E/E CMOS, 0.26 µm for static E/D CMOS, 0.29 µm for dynamic transmission-gate CMOS, and 0.45 µm for static E/D NMOS circuits are possible. At submicrometer dimensions, CMOS offers as much as a 3:1 scaling advantage in minimum channel length which translates to a 5:1 improvement in gate delay when compared to NMOS. Thus CMOS is projected as the dominant ULSI technology, not only due to its well known large operating margins, low static-power dissipation and design flexibility but also due to markedly superior speed.
Keywords
CMOS logic circuits; CMOS technology; Circuit noise; Driver circuits; Integrated circuit technology; MOS devices; Power dissipation; Semiconductor device modeling; Semiconductor device noise; Ultra large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1985.21947
Filename
1484694
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