Title :
Thin-Film Shielding for Microcircuit Applications and a Useful Laboratory Tool for Plane-Wave Shielding Evaluations
Author_Institution :
Electronic Components Laboratory, U. S. Army Electronics Command, Fort Monmouth, N. J. 07703
fDate :
3/1/1968 12:00:00 AM
Abstract :
The results of plane-wave shielding effectiveness tests on vacuum deposited metallic thin films are discussed. The test data are presented in graphical form for thin films of copper, aluminum, silver, gold, and nickel. Shielding effectiveness as high as 90 dB was obtained. In addition, a novel test instrument and measurement technique were devised for this study. The test procedure is described, design information for the construction of the test device is given, and a theoretical basis for its use is presented.
Keywords :
Aluminum; Copper; Gold; Instruments; Laboratories; Nickel; Silver; Sputtering; Testing; Transistors;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.1968.302914