DocumentCode
1098899
Title
Thin-Film Shielding for Microcircuit Applications and a Useful Laboratory Tool for Plane-Wave Shielding Evaluations
Author
Weck, Robert A.
Author_Institution
Electronic Components Laboratory, U. S. Army Electronics Command, Fort Monmouth, N. J. 07703
Issue
1
fYear
1968
fDate
3/1/1968 12:00:00 AM
Firstpage
105
Lastpage
112
Abstract
The results of plane-wave shielding effectiveness tests on vacuum deposited metallic thin films are discussed. The test data are presented in graphical form for thin films of copper, aluminum, silver, gold, and nickel. Shielding effectiveness as high as 90 dB was obtained. In addition, a novel test instrument and measurement technique were devised for this study. The test procedure is described, design information for the construction of the test device is given, and a theoretical basis for its use is presented.
Keywords
Aluminum; Copper; Gold; Instruments; Laboratories; Nickel; Silver; Sputtering; Testing; Transistors;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.1968.302914
Filename
4090373
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