DocumentCode
1098994
Title
An optimized and reliable LDD structure for 1-µm NMOSFET based on substrate current analysis
Author
Matsumoto, Yasuo ; Higuchi, Takayoshi ; Mizuno, Tomohisa ; Sawada, Shizuo ; Shinozaki, Satoshi ; Ozawa, Osamu
Author_Institution
Toshiba Corporation, Kawasaki, Japan
Volume
32
Issue
2
fYear
1985
fDate
2/1/1985 12:00:00 AM
Firstpage
429
Lastpage
433
Abstract
Optimization of the n-region concentration for n-channel MOSFET´s with a lightly doped drain (LDD) structure was investigated, based on an analysis of the substrate current characteristics. When a substrate current tailing is observed, which is peculiar to the LDDFET with a low-concentration n-region, a gate current is not observed, which suggests strong resistance against hot-carrier injection. This was confirmed by a bias stress test. The optimized surface concentration for the n-region ranges from 1 × 1018cm-3to 2.5 × 1018cm-3under negligible VTH shift and less than 25-percent driving capability degradation, compared to values for a conventional MOSFET.
Keywords
Acceleration; Breakdown voltage; Degradation; Etching; Fabrication; Hot carrier injection; MOSFET circuits; Stress; Substrate hot electron injection; Testing;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1985.21959
Filename
1484706
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