Title :
A wafer-scale digital integrator using restructurable VSLI
Author :
Raffel, J.I. ; Anderson, A.H. ; Chapman, G.H. ; Konkle, K.H. ; Mathur, B. ; Soares, A.M. ; Wyatt, P.W.
Author_Institution :
Massachusetts Institute of Technology, Lincoln Laboratory, Lexington, MA
fDate :
2/1/1985 12:00:00 AM
Abstract :
Wafer-scale integration has been demonstrated by fabricating a digital integrator on a monolithic 20-cm2silicon chip, the first laser-restructured digital logic system. Large-area integration is accomplished by laser programming of metal interconnect for defect avoidance. This paper describes the technology for laser welding and cutting, the design methodology and CAD tools developed for wafer-scale integration, and the integrator itself.
Keywords :
Design automation; Design methodology; Dielectrics; Integrated circuit interconnections; Laser beam cutting; Logic circuits; Optical design; Optical device fabrication; Silicon; Welding;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1985.21966
