DocumentCode
1099760
Title
Al/Si contact resistance for submicrometer design rules
Author
Ford, Jenny M.
Author_Institution
Motorola Semiconductor Research and Development Laboratory, Phoenix, AZ
Volume
32
Issue
4
fYear
1985
fDate
4/1/1985 12:00:00 AM
Firstpage
840
Lastpage
842
Abstract
The resistance of contacts between aluminum/1.5-percent silicon and doped silicon is experimentally determined as a function of contact sizes from 0.6 to 4 µm square. Silicon contacted was doped to varied concentrations with either boron or phosphorus. The magnitudes of resistances observed for submicrometer geometry contacts underscore the need for a lower resistance-contact process for high-performance VLSI.
Keywords
Analytical models; Contact resistance; Electrical resistance measurement; Electron devices; Geometry; Kelvin; Semiconductor process modeling; Silicon; Two dimensional displays; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1985.22030
Filename
1484776
Link To Document