• DocumentCode
    1099760
  • Title

    Al/Si contact resistance for submicrometer design rules

  • Author

    Ford, Jenny M.

  • Author_Institution
    Motorola Semiconductor Research and Development Laboratory, Phoenix, AZ
  • Volume
    32
  • Issue
    4
  • fYear
    1985
  • fDate
    4/1/1985 12:00:00 AM
  • Firstpage
    840
  • Lastpage
    842
  • Abstract
    The resistance of contacts between aluminum/1.5-percent silicon and doped silicon is experimentally determined as a function of contact sizes from 0.6 to 4 µm square. Silicon contacted was doped to varied concentrations with either boron or phosphorus. The magnitudes of resistances observed for submicrometer geometry contacts underscore the need for a lower resistance-contact process for high-performance VLSI.
  • Keywords
    Analytical models; Contact resistance; Electrical resistance measurement; Electron devices; Geometry; Kelvin; Semiconductor process modeling; Silicon; Two dimensional displays; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1985.22030
  • Filename
    1484776