DocumentCode :
109982
Title :
Improved Erasing Speed in Junctionless Flash Memory Device by {\\rm HfO}_{2}/{\\rm Si}_{3}{\\rm N}_{4} Stacked Trapping Layer
Author :
Chun-Yuan Chen ; Kuei-Shu Chang-Liao ; Kuen-Te Wu ; Tien-Ko Wang
Author_Institution :
Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume :
34
Issue :
8
fYear :
2013
fDate :
Aug. 2013
Firstpage :
993
Lastpage :
995
Abstract :
A junctionless (JL) polycrystalline-based flash memory device with HfO2/Si3N4(HN) stacked trapping layer is studied for the first time. Effects of the HN stacked trapping layer on JL and inversion-mode (IM) flash devices are compared. JL device shows faster programming speed than the IM one because of its heavily doped n-channel. Specially, comparable erasing speed of JL device can be achieved by HN stacked trapping layer due to more effective electron detrapping. JL device with HN stacked trapping layer also shows better retention characteristics and keeps a larger window after 105 programming/erasing cycles, which makes it promising for 3-D memory integration in the future.
Keywords :
flash memories; hafnium compounds; silicon compounds; 3D memory integration; HfO2-Si3N4; electron detrapping; erasing speed; heavily doped n-channel; inversion-mode flash devices; junctionless polycrystalline-based flash memory device; programming speed; retention characteristics; stacked trapping layer; ${rm Si}_{3}{rm N}_{4}$; Charge-trapping; flash memory ${rm HfO}_{2}$; high- $kappa$; junctionless; poly-Si;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2013.2265599
Filename :
6542684
Link To Document :
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