Optimal interconnection circuits for VLSI

The propagation delay of interconnection lines is a major factor in determining the performance Of VLSI circuits because the RC time delay of these lines increases rapidly as chip size is increased and cross-sectional interconnection dimensions are reduced. In this paper, a model for interconnection time delay is developed that includes the effects of scaling transistor, interconnection, and chip dimensions. The delays of aluminum, WSi2, and polysilicon lines are compared, and propagation delays in future VLSI circuits are projected. Properly scaled multilevel conductors, repeaters, cascaded drivers, and cascaded driver/ repeater combinations are investigated as potential methods for reducing propagation delay. The model yields optimal cross-sectional interconnection dimensions and driver/repeater configurations that can lower propagation delays by more than an order of magnitude in MOSFET circuits.