Title :
Fabrication techniques for a novel three-dimensional monolithic integrated circuit transmission line in silicon
Author :
Yarbrough, A.D. ; Dalman, G.C. ; Lee, C.A.
Author_Institution :
Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
fDate :
12/8/1988 12:00:00 AM
Abstract :
A novel integrated circuit transmission line, trench waveguide, has been developed for high frequency/high speed applications. The three-dimensional structure is suitable as a low impedance interconnect. The fabrication process developed uses special wet etch, and angle evaporation techniques. Measurements on large-scale models of the device yielded impedances as low as 12 Ω
Keywords :
elemental semiconductors; integrated circuit technology; monolithic integrated circuits; transmission lines; Si; angle evaporation techniques; large-scale models; low impedance interconnect; three-dimensional monolithic integrated circuit transmission line; three-dimensional structure; trench waveguide; wet etch;
Journal_Title :
Electronics Letters
