Title :
Optical data buses for automotive applications
Author :
Kibler, Thomas ; Poferl, Stefan ; Böck, Gotthard ; Huber, Hans-Peter ; Zeeb, Eberhard
Author_Institution :
DaimlerChrysler AG, Ulm, Germany
Abstract :
Optical data links and bus systems are becoming increasingly attractive for automobiles. In 1998, a first optical data bus system, based on polymer optical fibers and visible light-emitting diodes was introduced in Mercedes-Benz cars to interconnect information and entertainment devices within the passenger compartment. Since 2002, media-oriented system transport (MOST) is the standard for an optical infotainment data bus system in the automotive industry. However, with increasing demands on network flexibility, robustness, safety-relevant functions, and data rate, the currently used technologies reach their limit. A new physical layer, based on 200-μm polymer-cladded silica fibers and infrared-emitting vertical-cavity surface-emitting lasers, is a promising solution. This paper provides an overview about the state-of-the-art physical layer of standard MOST data bus systems, shows its limitations, and presents new optical-physical-layer concepts for next-generation data bus systems in cars.
Keywords :
automobiles; optical fibre cladding; optical fibre networks; optical polymers; surface emitting lasers; system buses; automobiles; information interconnection; infrared-emitting vertical-cavity surface-emitting lasers; media-oriented system transport; optical data buses; optical data links; optical infotainment data bus system; polymer optical fibers; polymer-cladded silica fibers; Automobiles; Automotive applications; Data buses; Optical devices; Optical fibers; Optical interconnections; Optical polymers; Organic light emitting diodes; Physical layer; Vertical cavity surface emitting lasers; Cars; PCS; POF; VCSEL; fiber; flat flexible wiring; optical data bus; polymer optical fiber; polymer-cladded silica; vertical-cavity surface-emitting laser;
Journal_Title :
Lightwave Technology, Journal of
DOI :
10.1109/JLT.2004.833784