DocumentCode
1100408
Title
Fabrication of fully self-aligned joint-gate CMOS structures
Author
Robinson, A.L. ; Antoniadis, D.A. ; Maby, E.W.
Author_Institution
General Electric Company, Schenectady, NY
Volume
32
Issue
6
fYear
1985
fDate
6/1/1985 12:00:00 AM
Firstpage
1140
Lastpage
1142
Abstract
A six-mask process that yields stacked CMOS structures with the source and drain of both transistors self-aligned to a joint-gate electrode has been developed. The features that permit full self-alignment are an edge-defined silicon nitride "filament," used as an oxidation mask, and overlapping polysilicon "handles," used to form the top transistor source and drain regions. The individual NMOS and PMOS transistors have been characterized and together are functional in joint-gate CMOS inverters.
Keywords
CMOS process; CMOS technology; Capacitance; Circuits; Computer science; Electrodes; Fabrication; Nonhomogeneous media; Oxidation; Silicon;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1985.22087
Filename
1484833
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