• DocumentCode
    1100408
  • Title

    Fabrication of fully self-aligned joint-gate CMOS structures

  • Author

    Robinson, A.L. ; Antoniadis, D.A. ; Maby, E.W.

  • Author_Institution
    General Electric Company, Schenectady, NY
  • Volume
    32
  • Issue
    6
  • fYear
    1985
  • fDate
    6/1/1985 12:00:00 AM
  • Firstpage
    1140
  • Lastpage
    1142
  • Abstract
    A six-mask process that yields stacked CMOS structures with the source and drain of both transistors self-aligned to a joint-gate electrode has been developed. The features that permit full self-alignment are an edge-defined silicon nitride "filament," used as an oxidation mask, and overlapping polysilicon "handles," used to form the top transistor source and drain regions. The individual NMOS and PMOS transistors have been characterized and together are functional in joint-gate CMOS inverters.
  • Keywords
    CMOS process; CMOS technology; Capacitance; Circuits; Computer science; Electrodes; Fabrication; Nonhomogeneous media; Oxidation; Silicon;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1985.22087
  • Filename
    1484833