• DocumentCode
    110052
  • Title

    Impact of Aluminum Ion Implantation on the Low Frequency Noise Characteristics of Hf-Based High- (k) /Metal Gate pMOSFETs

  • Author

    Tsung-Hsien Kao ; San-Lein Wu ; Chung-Yi Wu ; Yean-Kuen Fang ; Bo-Chin Wang ; Po Chin Huang ; Chien-Ming Lai ; Chia-Wei Hsu ; Yi-Wen Chen ; Cheng, Osbert ; Shoou-Jinn Chang

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • Volume
    35
  • Issue
    9
  • fYear
    2014
  • fDate
    Sept. 2014
  • Firstpage
    954
  • Lastpage
    956
  • Abstract
    The impact of aluminum ion implantation (Al I/I) on the 1/f noise and random telegraph noise (RTN) characteristics of high-k/metal gate (HK/MG) pMOSFETs is investigated. The Al I/I technology was implemented to tune the effective work function (EWF) of pMOSFETs without increasing the equivalent oxide thickness and complicating the process. The RTN and 1/f noise results showed that irrespective of the implanted dose, the HK/MG devices with Al I/I still exhibit lower slow oxide trap densities for the control device, because the Al filled the defect and formed a thin Al2O3 layer. In addition, for the HK/MG devices with different implanted doses, no significant differences in the trap properties are noted. However, the modulated EWF can be attributed to the Al I/I-induced dipoles at the HfO2/SiO2 interface.
  • Keywords
    1/f noise; MOSFET; aluminium compounds; hafnium compounds; high-k dielectric thin films; ion implantation; semiconductor device noise; silicon compounds; work function; 1/f noise; Al2O3; EWF; HfO2-SiO2; effective work function; equivalent oxide thickness; high-k-metal gate pMOSFET; ion implantation; low frequency noise; oxide trap density; random telegraph noise; 1f noise; High K dielectric materials; Logic gates; Low-frequency noise; MOSFET; Metals; 1/ (f) noise; 1/ƒ noise; HK/MG pMOSFETs; Random telegraph noise (RTN); aluminum ion implantation;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2336866
  • Filename
    6866112