Cost saving opportunities with multichip modules

Multichip modules (MCMs) have been utilized in the electronics industry, predominantly for physical size and performance driven applications. An MCM application that was driven by cost is described. The study of MCM technologies focused on the MCM assembly and interconnect to the motherboard. Models were developed to calculate the assembly and test costs for MCMs using wirebond and TAB technologies. Another model was used to evaluate interconnect options, both separable and nonseparable (e.g. soldered). A cost analysis verified that a significant cost savings was achieved by using MCM technology and, along with a technical evaluation of the alternatives, led to an MCM physical design for this application