Title :
Mapping Defect Density in MBE Grown
Epitaxial Layers on Si Substrate Using Esaki Diode Valley Characteristics
Author :
Majumdar, K. ; Thomas, Paul ; Wei-Yip Loh ; Pui-Yee Hung ; Matthews, K. ; Pawlik, David ; Romanczyk, Brian ; Filmer, Matthew ; Gaur, Ayush ; Droopad, Ravi ; Rommel, Sean L. ; Hobbs, Chris ; Kirsch, P.D.
Author_Institution :
Sematech, Albany, NY, USA
Abstract :
Growing good quality III-V epitaxial layers on Si substrate is of utmost importance to produce next generation high-performance devices in a cost effective way. In this paper, using physical analysis and electrical measurements of Esaki diodes, fabricated using molecular beam epitaxy grown In0.53Ga0.47As layers on Si substrate, we show that the valley current density is strongly correlated with the underlying epi defect density. Such a strong correlation indicates that the valley characteristics can be used to monitor the epi quality. A model is proposed to explain the experimental observations and is validated using multiple temperature diode I-V data. An excess defect density is introduced within the device using electrical and mechanical stress, both of which are found to have a direct impact on the valley current with a negligible change in the peak current characteristics, qualitatively supporting the model predictions.
Keywords :
III-V semiconductors; crystal defects; elemental semiconductors; epitaxial layers; gallium arsenide; indium compounds; molecular beam epitaxial growth; silicon; tunnel diodes; Esaki diode valley characteristics; In0.53Ga0.47As; MBE; Si; defect density; electrical measurements; electrical stress; epitaxial layers; mechanical stress; molecular beam epitaxy; next generation high performance devices; physical analysis; valley current density; Current density; Photonic band gap; Silicon; Stress; Substrates; Temperature; Tunneling; Esaki diode; III-V on Si; III??V on Si; epi defect density; excess current; negative differential resistance; tunneling; tunneling.;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2318597