DocumentCode
1102665
Title
Fundamentals of memory switching in vertical polycrystalline silicon structures
Author
Malhotra, Vinod ; Mahan, John E. ; Ellsworth, Daniel L.
Author_Institution
Colorado State University, Fort Collins, CO
Volume
32
Issue
11
fYear
1985
fDate
11/1/1985 12:00:00 AM
Firstpage
2441
Lastpage
2449
Abstract
The fundamentals of memory switching in vertical LPCVD polysilicon structures have been investigated. In the initial state, 4-70 µm2devices exhibit effective resistances (at 5 V) in the high megaohm range, with current transport via thermionic emission of electrons over grain boundary potential barriers. An increase in conductance by approximately five orders of magnitude is achieved by a 10-20 V programming pulse of tens of microseconds duration with a few milliamps of current required. A moderately doped filamentary region is created, exhibiting single-crystal silicon transport phenomena. With regard to practical device fabrication, control of thin film interactions is critical. Barrier layers are employed to suppress Al-Si interaction at the top contact and to decrease the effective grain size of the polysilicon film by limiting the epitaxial realignment of the grains near the single-crystal substrate.
Keywords
Conducting materials; Electron emission; Fabrication; Grain boundaries; Implants; PROM; Silicon; Thermionic emission; Thin film devices; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1985.22293
Filename
1485039
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