DocumentCode :
1103341
Title :
Scaling the MOS transistor below 0.1 μm: methodology, device structures, and technology requirements
Author :
Fiegna, Claudio ; Iwai, Hiroshi ; Wada, Tetsunori ; Saito, Masanobu ; Sangiorgi, Enrico ; Riccò, Bruno
Volume :
41
Issue :
6
fYear :
1994
fDate :
6/1/1994 12:00:00 AM
Firstpage :
941
Lastpage :
951
Abstract :
This work is a systematic investigation of the feasibility of MOSFET´s with a gate length below 0.1 μm. Limits imposed on the scalability of oxide thickness and supply voltage require a new scaling methodology which allows these parameters to be maintained constant. The feasibility of achieving sub-0.1 μm MOSFETs in this way is evaluated through simulations of the electrical characteristics of several different device structures and by addressing the most important issues related to the scaling down to ultra-short gate lengths. This study forms a valuable starting point for the understanding of technological requirements for future ULSI
Keywords :
MOS integrated circuits; VLSI; hot carriers; insulated gate field effect transistors; integrated circuit technology; semiconductor device models; 0.1 micron; MOS transistor scaling; MOSFET; ULSI; device structures; electrical characteristics; oxide thickness; scalability; scaling methodology; simulations; supply voltage; ultrashort gate lengths; Degradation; Doping; Electric variables; Hot carrier effects; MOSFETs; Research and development; Scalability; Threshold voltage; Tunneling; Ultra large scale integration;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.293306
Filename :
293306
Link To Document :
بازگشت