DocumentCode :
1103779
Title :
Source-to-drain breakdown voltage improvement in ultrathin-film SOI MOSFET´s using a gate-overlapped LDD structure
Author :
Yamaguchi, Yasuo ; Iwamatsu, Toshiaki ; Joachim, Hans-Oliver ; Oda, Hidekazu ; Inoue, Yasuo ; Nishimura, Tadashi ; Tsukamoto, Katsuhiro
Author_Institution :
Soc. of Appl. Phys., Japan
Volume :
41
Issue :
7
fYear :
1994
fDate :
7/1/1994 12:00:00 AM
Firstpage :
1222
Lastpage :
1226
Abstract :
A gate-overlapped LDD structure was introduced to ultra-thin SOI MOSFET´s in order to overcome the degradation in source-to-drain breakdown voltage (BVds) due to a parasitic bipolar action. By reductions in drain electric field and parasitic resistance at a source n- region, the BVds was improved with almost the same current drivability as that in single drain structure. The behavior of the BVds on LDD n- concentration was investigated by use of a numerical device simulator, and it was found that the electric field at a lower portion of the n- region, which forms the current path, was relaxed effectively at an optimum n- doping condition
Keywords :
doping profiles; impact ionisation; insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; silicon; current drivability; current path; drain electric field; gate-overlapped LDD structure; numerical device simulator; optimum doping condition; parasitic bipolar action; source-to-drain breakdown voltage; ultrathin-film SOI MOSFETs; Breakdown voltage; Charge carrier processes; Degradation; Doping; Equations; Immune system; Impact ionization; Impurities; MOSFET circuits; Numerical simulation;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.293351
Filename :
293351
Link To Document :
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