DocumentCode :
1103962
Title :
Good things, small packages [microelectromechanical systems]
Author :
Anscombe, Nadya
Volume :
83
Issue :
3
fYear :
2004
Firstpage :
10
Lastpage :
13
Abstract :
While semiconductor chip manufacturers still suffer from the recent downturn, the future looks a little brighter for microelectromechanical systems (MEMS). Also called microsystems and micromachines, these devices are found in many diverse applications, such as air bag sensors, ink-jet heads, medical sensors and telecommunication switches. MEMS can be manufactured from a variety of materials using a variety of processes in a variety of steps. For the foundry industries, it creates problems because each process can only be used for one customer. Because of their application-specific nature, MEMS devices often have to be designed using proprietary manufacturing processes that are specific to one manufacturing facility. In this paper, the author examined the surrounding issues in manufacturing MEMS as well as the probable solutions hypothesized by different experts.
Keywords :
CMOS integrated circuits; design for manufacture; micromechanical devices; CMOS-compatible processes; foundry industries; manufacturing processes; microelectromechanical systems; micromachines; microsystems;
fLanguage :
English
Journal_Title :
Manufacturing Engineer
Publisher :
iet
ISSN :
0956-9944
Type :
jour
DOI :
10.1049/me:20040301
Filename :
1334722
Link To Document :
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