DocumentCode
110409
Title
A Hybrid FDFD–MoM Technique for Susceptibility Evaluation of a Transmission Line Inside a Perforated Enclosure
Author
Azadifar, Mohammad ; Dehkhoda, P. ; Sadeghi, S.H.H. ; Moini, R.
Author_Institution
Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
Volume
56
Issue
6
fYear
2014
fDate
Dec. 2014
Firstpage
1474
Lastpage
1479
Abstract
The paper proposes an efficient hybrid technique based on the finite-difference frequency-domain (FDFD) method and the method of moments (MoM) to study the susceptibility of a terminated microstrip transmission line (MTL) inside a perforated rectangular enclosure. The complex geometry of the inside cavity region is treated by an efficient FDFD method, whereas the unbounded outside region of the enclosure is analyzed by a MoM solution. To account for the relatively thin microstrip dielectric, a nonuniform meshing scheme is adopted for the FDFD method. Also, linear lumped elements connected to the MTL are modeled by changing the related node information in the mesh according to the element type and direction. The validity of the proposed technique is confirmed by comparing our simulation results with those obtained using a commercial finite integration code and measurement results.
Keywords
finite difference methods; frequency-domain analysis; lumped parameter networks; method of moments; microstrip lines; transmission line theory; MTL; cavity region; complex geometry; efficient hybrid technique; finite integration code; finite-difference frequency-domain method; hybrid FDFD-MoM technique; linear lumped elements; method of moments; microstrip dielectric; microstrip transmission line; nonuniform meshing scheme; perforated rectangular enclosure; susceptibility evaluation; Apertures; Dielectrics; Method of moments; Ports (Computers); Transmission line measurements; Voltage measurement; Enclosure; finite-difference frequency-domain (FDFD) method; method of moments (MoM); susceptibility; transmission line;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2014.2335271
Filename
6866145
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