DocumentCode :
110409
Title :
A Hybrid FDFD–MoM Technique for Susceptibility Evaluation of a Transmission Line Inside a Perforated Enclosure
Author :
Azadifar, Mohammad ; Dehkhoda, P. ; Sadeghi, S.H.H. ; Moini, R.
Author_Institution :
Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
Volume :
56
Issue :
6
fYear :
2014
fDate :
Dec. 2014
Firstpage :
1474
Lastpage :
1479
Abstract :
The paper proposes an efficient hybrid technique based on the finite-difference frequency-domain (FDFD) method and the method of moments (MoM) to study the susceptibility of a terminated microstrip transmission line (MTL) inside a perforated rectangular enclosure. The complex geometry of the inside cavity region is treated by an efficient FDFD method, whereas the unbounded outside region of the enclosure is analyzed by a MoM solution. To account for the relatively thin microstrip dielectric, a nonuniform meshing scheme is adopted for the FDFD method. Also, linear lumped elements connected to the MTL are modeled by changing the related node information in the mesh according to the element type and direction. The validity of the proposed technique is confirmed by comparing our simulation results with those obtained using a commercial finite integration code and measurement results.
Keywords :
finite difference methods; frequency-domain analysis; lumped parameter networks; method of moments; microstrip lines; transmission line theory; MTL; cavity region; complex geometry; efficient hybrid technique; finite integration code; finite-difference frequency-domain method; hybrid FDFD-MoM technique; linear lumped elements; method of moments; microstrip dielectric; microstrip transmission line; nonuniform meshing scheme; perforated rectangular enclosure; susceptibility evaluation; Apertures; Dielectrics; Method of moments; Ports (Computers); Transmission line measurements; Voltage measurement; Enclosure; finite-difference frequency-domain (FDFD) method; method of moments (MoM); susceptibility; transmission line;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2014.2335271
Filename :
6866145
Link To Document :
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