DocumentCode :
1105499
Title :
Interval-Valued Reduced-Order Statistical Interconnect Modeling
Author :
Ma, James D. ; Rutenbar, Rob A.
Author_Institution :
Carnegie Mellon Univ., Pittsburgh
Volume :
26
Issue :
9
fYear :
2007
Firstpage :
1602
Lastpage :
1613
Abstract :
We show how advances in the handling of correlated interval representations of range uncertainty can be used to approximate the mass of a probability density function as it moves through numerical operations and, in particular, to predict the impact of statistical manufacturing variations on linear interconnect. We represent correlated statistical variations in resistance-inductance-capacitance parameters as sets of correlated intervals and show how classical model-order reduction methods - asymptotic waveform evaluation and passive reduced-order interconnect macromodeling algorithm - can be retargeted to compute interval-valued, rather than scalar-valued, reductions. By applying a simple statistical interpretation and sampling to the resulting compact interval-valued model, we can efficiently estimate the impact of variations on the original circuit. Results show that the technique can predict mean delay and standard deviation with errors between 5% and 10% for correlated parameter variations up to 35%.
Keywords :
capacitance; design for manufacture; electric admittance; electric resistance; integrated circuit interconnections; statistical analysis; asymptotic waveform evaluation; model-order reduction method; passive reduced-order interconnect macromodeling; probability density function; reduced-order statistical interconnect modeling; resistance-inductance-capacitance parameter; statistical manufacturing variation; Circuit simulation; Delay; Design automation; Gaussian distribution; Integrated circuit interconnections; Predictive models; RLC circuits; Semiconductor device manufacture; Timing; Virtual manufacturing; Affine arithmetic; design-for-manufacturing; interconnect simulation; numerical analysis; statistical modeling;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2007.895577
Filename :
4294038
Link To Document :
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