DocumentCode :
1108695
Title :
High strength Nb3Sn conductors for high magnetic field applications
Author :
Gregory, E. ; Motowidlo, L.R. ; Ozeryansky, G.M. ; Summers, LT
Author_Institution :
IGC/Adv. Superconductors Inc., Waterbury, CT, USA
Volume :
27
Issue :
2
fYear :
1991
fDate :
3/1/1991 12:00:00 AM
Firstpage :
2033
Lastpage :
2036
Abstract :
A relatively-high-conductivity copper-based material which retains its high strength after reaction heat treatment has been used to replace some of the copper stabilizer, both on the outside of the conductor and between the filaments. It is shown that a dispersion hardened copper alloy, C15715, containing 0.7 vol.% Al2O3, can be incorporated into a tabular tin source (TTS) material in two different locations, without significant fabrication problems. The alloy could also be applied to the other processes for producing the Nb3Sn, including the bronze process. When the alloy is located between the filaments, it should decrease the sausaging that may occur in the certain designs. When used to replace the high purity copper stabilizer on the outside of the TTS and conventional internal tin materials, very significant increases in the overall strength of the conductor result
Keywords :
composite superconductors; critical current density (superconductivity); extrusion; hot working; niobium alloys; stress-strain relations; tensile strength; tin alloys; type II superconductors; yield strength; A15 superconductor; Cu-Al2O3 composite stabiliser; Nb3Sn superconductors; Nb3Sn-Cu-Al2O3; bronze process; critical currents; high magnetic field applications; high strength superconductors; hot extrusion; precompression; sausaging; stress-strain curves; superconducting magnets; tabular tin source; tensile strength; yield strength; Conducting materials; Conductors; Copper; Magnetic fields; Niobium; Superconducting magnets; Superconductivity; Temperature; Thermal conductivity; Tin;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.133606
Filename :
133606
Link To Document :
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