• DocumentCode
    1109991
  • Title

    Improved Electric Field Integral Equation (IEFIE) for Analysis of Scattering From 3-D Conducting Structures

  • Author

    Hu, Jun ; Nie, Zaiping

  • Author_Institution
    Univ. of Electron. Sci. & Technol. of China, Chengdu
  • Volume
    49
  • Issue
    3
  • fYear
    2007
  • Firstpage
    644
  • Lastpage
    648
  • Abstract
    In this paper, a novel improved electric field integral equation (IEFIE) is developed to achieve fast and accurate solution of electromagnetic scattering from 3-D conducting structures. By adding the principle value term of the magnetic field integral equation (MFIE) operator into the EFIE operator, a well-conditioned improved EFIE operator is constructed. To achieve a reasonable accuracy, several update steps for the current vector are required. A multilevel fast multipole algorithm (MLFMA) is also applied to accelerate the computation of matrix-vector multiplications in the iteration. The present method attains much faster convergence of iterations than traditional EFIE and much better accuracy of the solution than the traditional combined field integral equation, particularly for 3-D structures with open or sharp surfaces. Numerical results show the validity and efficiency of the present method.
  • Keywords
    conducting bodies; electric field integral equations; electromagnetic wave scattering; iterative methods; magnetic field integral equations; matrix algebra; 3D conducting structures; IEFIE; MFIE; electric field integral equation; electromagnetic scattering; magnetic field integral equation; matrix-vector multiplications; multilevel fast multipole algorithm; Acceleration; Educational institutions; Electromagnetic analysis; Electromagnetic radiation; Electromagnetic scattering; Integral equations; Large-scale systems; MLFMA; Magnetic fields; Surface treatment; Combined field integral equation; conjugate gradient iteration; electric field integral equation; magnetic field integral equation; multilevel fast multipole algorithm (MLMFA);
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2007.902182
  • Filename
    4295214