DocumentCode :
1111677
Title :
Low-noise HEMT using MOCVD
Author :
Tanaka, Kuninobu ; Ogawa, Masamichi ; Togashi, Kou ; Takakuwa, Hidemi ; Ohke, Hajime ; Kanazawa, Masayoshi ; Kato, Yoji ; Watanabe, Seiichi
Author_Institution :
Sony Corporation, Atsugi, Kanagawa, Japan
Volume :
33
Issue :
12
fYear :
1986
fDate :
12/1/1986 12:00:00 AM
Firstpage :
2053
Lastpage :
2058
Abstract :
Low-noise HEMT AlGaAs/GaAs heterostructure devices have been developed using metal organic chemical vapor deposition (MOCVD). The HEMT´s with 0.5-µm-long and 200-µm-wide gates have shown a minimum noise figure of 0.83 dB with an associated gain of 12.5 dB at 12 GHz at room temperature. Measurements have confirmed calculations on the effect of the number of gate bonding pads On the noise figure for different gate Widths. Substantial noise figure improvement was observed Under low-temperature operation, especially compared to conventional GaAs MESFET´s. A two-stage amplifier designed for DBS reception using the HEMT in the first stage has displayed a noise figure under 2.0 dB from 11.7 to 12.2 GHz.
Keywords :
Bonding; Chemical vapor deposition; Gain; Gallium arsenide; HEMTs; MOCVD; Noise figure; Noise measurement; Organic chemicals; Temperature measurement;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1986.22867
Filename :
1486084
Link To Document :
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