Title :
Optical path redirected multichannel waveguide connectors for surface mount technologies
Author :
Hiramatsu, Seiki ; Kinosihta, Masao
Author_Institution :
Electron. Syst. Integration Technol. Res. Dev., Assoc. of Super-Adv. Electron. Technol., Tokyo, Japan
Abstract :
Novel optical path redirected multichannel waveguide connectors that are fully compatible with surface mount technologies are demonstrated. These connectors have three-dimensional waveguide devices with multichannel optical inputs-outputs and optical path redirection for higher integration. A wafer-level stack and lamination process was used to fabricate these waveguide devices. To ensure low-cost fabrication and suitability for mass production, the fabricated waveguide connectors were mounted on printed circuit boards using a flip-chip bonder. These connectors can be efficiently coupled to commercially available multichannel mechanically transferable connectors. In this letter, we describe the fabrication of these waveguide connectors and the test results for them.
Keywords :
integrated optics; optical couplers; optical fabrication; optical interconnections; optical waveguides; surface mount technology; flip-chip bonder; lamination; low-cost fabrication; mass production; mechanically transferable connectors; multichannel optical inputs-outputs; multichannel waveguide connectors; optical path redirection; printed circuit boards; surface mount technologies; three-dimensional waveguide devices; wafer-level stack; Connectors; Integrated optics; Lamination; Mass production; Optical device fabrication; Optical devices; Optical waveguides; Printed circuits; Surface-mount technology; Wafer bonding;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2004.834528