DocumentCode :
111252
Title :
Deep Levels Characterization in GaN HEMTs—Part II: Experimental and Numerical Evaluation of Self-Heating Effects on the Extraction of Traps Activation Energy
Author :
Chini, Alessandro ; Soci, F. ; Meneghini, Matteo ; Meneghesso, Gaudenzio ; Zanoni, Enrico
Author_Institution :
Dept. of Eng. Enzo Ferrari, Univ. of Modena & Reggio Emilia, Modena, Italy
Volume :
60
Issue :
10
fYear :
2013
fDate :
Oct. 2013
Firstpage :
3176
Lastpage :
3182
Abstract :
In this paper, the effects of device self-heating on the extraction of traps activation energy are investigated through experimental measurements and numerical simulations. Neglecting the device temperature increase during the experimental measurements can lead to an underestimation of traps activation energies as well as nonoverlapping Arrhenius plots. It will be shown that said artifacts can be removed once device thermal resistance is known and used to correct the temperatures data points at which trap time constants are extracted. The correctness of the proposed method is also supported through numerical simulations carried out both by neglecting and considering thermal effects during the drain current transient measurements. Finally, the experimental results obtained are also suggesting a novel method for the extraction of device thermal resistance, which yielded comparable results with respect to those obtained with other experimental techniques.
Keywords :
III-V semiconductors; gallium compounds; high electron mobility transistors; wide band gap semiconductors; deep level characterization; device self-heating effects; device thermal resistance; drain current transient measurement; experimental measurement; nonoverlapping Arrhenius plots; numerical simulation; temperatures data points; trap activation energy; trap time constant; Current measurement; Gallium nitride; HEMTs; Logic gates; Temperature distribution; Temperature measurement; Transient analysis; Charge carrier processes; MODFETs; gallium nitride; power semiconductor devices; reliability;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2278290
Filename :
6589142
Link To Document :
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