Air-Gap Transmission Lines on Organic Substrates for Low-Loss Interconnects

Author

Spencer, Todd J. ; Joseph, Paul Jayachandran ; Kim, Tae Hong ; Swaminathan, Madhavan ; Kohl, Paul A.

Author_Institution

Georgia Inst. of Technol., Atlanta

Volume

55

Issue

9

fYear

2007

Firstpage

1919

Lastpage

1925

Abstract

The fabrication of low-loss transmission line structures with an air dielectric layer is described. The channels are characterized at low frequency (10 and 100 kHz) using capacitance and loss tangent and at high frequency (500 MHz to 10 GHz) using -parameter measurements. The incorporation of an air gap resulted in structures with effective dielectric constants between 1.5-1.8 and significantly lower loss tangents. The fabrication technique could be used to create more complicated air gap transmission line structures for use in monolithic microwave integrated circuits.

Keywords

MMIC; S-parameters; interconnections; organic compounds; transmission line theory; S-parameter measurements; air dielectric layer; air-gap transmission lines; dielectric constants; frequency 10 kHz to 100 kHz; frequency 500 MHz to 10 GHz; low-loss interconnects; monolithic microwave integrated circuits; organic substrates; Air gaps; Capacitance measurement; Dielectric loss measurement; Dielectric measurements; Dielectric substrates; Fabrication; Frequency; Integrated circuit interconnections; Transmission line measurements; Transmission lines; Air gaps; dielectric losses; multiprocessor interconnection; transmission lines;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2007.904326

Filename

4298216