• DocumentCode
    1112919
  • Title

    A vertical Kelvin test structure for measuring the true pecific contact resistivity

  • Author

    Lei, Tan Fu ; Leu, Len-Yi ; Lee, Chung Len

  • Author_Institution
    National Chiao Tung University, Hsin Chu, Taiwan, Republic of China
  • Volume
    7
  • Issue
    4
  • fYear
    1986
  • fDate
    4/1/1986 12:00:00 AM
  • Firstpage
    259
  • Lastpage
    261
  • Abstract
    A vertical Kelvin test structure, which can be used to measure the true specific contact resistivity of a metallization system, is proposed and studied. For this test structure, the driving current flows "vertically," thus the sheet resistance and current crowding effects are eliminated and measurement on the true specific contact resistivity becomes possible. Experimental works show that this test structure gives a more linear relation between resistance and contact area than the conventional six-terminal test structure.
  • Keywords
    Area measurement; Conductivity; Contact resistance; Current measurement; Electrical resistance measurement; Kelvin; Metallization; Proximity effect; System testing; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1986.26365
  • Filename
    1486188