DocumentCode :
1112919
Title :
A vertical Kelvin test structure for measuring the true pecific contact resistivity
Author :
Lei, Tan Fu ; Leu, Len-Yi ; Lee, Chung Len
Author_Institution :
National Chiao Tung University, Hsin Chu, Taiwan, Republic of China
Volume :
7
Issue :
4
fYear :
1986
fDate :
4/1/1986 12:00:00 AM
Firstpage :
259
Lastpage :
261
Abstract :
A vertical Kelvin test structure, which can be used to measure the true specific contact resistivity of a metallization system, is proposed and studied. For this test structure, the driving current flows "vertically," thus the sheet resistance and current crowding effects are eliminated and measurement on the true specific contact resistivity becomes possible. Experimental works show that this test structure gives a more linear relation between resistance and contact area than the conventional six-terminal test structure.
Keywords :
Area measurement; Conductivity; Contact resistance; Current measurement; Electrical resistance measurement; Kelvin; Metallization; Proximity effect; System testing; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1986.26365
Filename :
1486188
Link To Document :
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