Title :
1-cc Computer: Cross-Layer Integration With UWB-IR Communication and Locationing
Author :
Nakagawa, Tatsuo ; Ono, Goichi ; Fujiwara, Ryosuke ; Norimatsu, Takayasu ; Terada, Takahide ; Miyazaki, Masayuki ; Suzuki, Kei ; Yano, Kazuo ; Ogata, Yuji ; Maeki, Akira ; Kobayashi, Shinsuke ; Koshizuka, Noboru ; Sakamura, Ken
Author_Institution :
Hitachi Ltd., Tokyo
fDate :
4/1/2008 12:00:00 AM
Abstract :
The first one-cc or one-cubic-centimeter computer (OCCC) that integrates a sensor, ultra-wideband impulse radio (UWB-IR) transmitter, computing engine, and battery is demonstrated. Cross-layer integration includes SPIKE control, which achieves a record low power communication of 3.4-nW/bps with reduced operating time. Miniaturization techniques, such as wafer-level chip-size packaging and flip-chip packaging, were used to shrink the module to a volume of 1 cc. The fabricated OCCC is shown to operate as designed, communicating at distances of 10 and 30 m and at transmission rates of 10.7 Mbps and 258 kbps, respectively. The life of a 150-mAh battery in an OCCC that operates once every five minutes is estimated to be longer than 10 years. The communication-location integration (CLI) technique, which achieves 22-cm location accuracy with only a 1.3% chip area overhead, is also proposed.
Keywords :
flip-chip devices; low-power electronics; microcomputers; radio direction-finding; radio transmitters; ultra wideband communication; wafer level packaging; SPIKE control; UWB-IR transmitter; communication-location integration; cross-layer integration; flip-chip packaging; low power communication; miniaturization techniques; one-cubic-centimeter computer; ultra-wideband impulse radio transmitter; wafer-level chip-size packaging; Batteries; Communication system control; Laboratories; Medical services; Military computing; Mobile communication; Packaging; Personal digital assistants; Ultra wideband technology; Wafer scale integration; 1-cc computer; locationing; low power; ultra-wideband impulse radio (UWB-IR);
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2008.917543