Integrated optical waveguides in polyimide for wafer scale integration

Author

Selvaraj, Ravi ; Lin, H.T. ; McDonald, J.F.

Author_Institution

Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA

Volume

6

Issue

6

fYear

1988

fDate

6/1/1988 12:00:00 AM

Firstpage

1034

Lastpage

1044

Abstract

Optical interconnections promise several key advantages over their electrical counterparts such as large bandwidth and reduced propagation delay. The limitations of electrical interconnections become even more significant for wafer scale integration (WSI), and wafer scale hybrid packaging (WSHP) because of the length of wafer scale interconnections. The authors investigate the possibility of using optically transparent organic dielectrics such as certain polyimides as waveguide materials for integrated optical waveguides, and the use of a focused ion beam (FIB) for micromachining optical structures such as mirrors

Keywords

VLSI; integrated circuit technology; integrated optics; optical waveguides; polymers; FIB; WSHP; WSI; bandwidth; electrical interconnections; focused ion beam; integrated optical waveguides; micromachining; mirrors; optically transparent organic dielectrics; polyimide; propagation delay; wafer scale hybrid packaging; wafer scale integration; Bandwidth; Dielectrics; Integrated optics; Optical interconnections; Optical waveguides; Packaging; Particle beam optics; Polyimides; Propagation delay; Wafer scale integration;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/50.4096

Filename

4096