Sensitivity analysis and design optimization of beveled p-n junctions

This paper presents the development of a design model for the evaluation of an optimal surface-termination profile for off-state semiconductor device problems. The finite element method is used in the analysis phase and a moving mesh technique using slack elements is described and its effectiveness demonstrated. Examples of a step p⁺- n junction and a diffused n-p junction with a variable bevel angle are considered, and the results are compared quantitatively with finite difference solutions. Due to its generality, the technique can be employed in many device design applications and suggestions are made for the extension of this work to free surface profiles and device layout.