Title :
Highly efficient manifold microchannel heatsink
Author :
Wang, Y. ; Ding, G.F. ; Fu, S.
Author_Institution :
Shanghai Jiao Tong Univ., Shanghai
Abstract :
A manifold microchannel heatsink with high local heat transfer efficiency is presented. CFX simulation indicates that the microchannel heatsink has higher heat transfer efficiency than the conventional structure. Infrared tests demonstrate the dependence of substrate steady-state temperature on flow rate, 0.64-6.7 ml/min, with heat flux of 104000 W/m2. Maximum heat flux input, 203000 W/m2, is obtained for 6.7 ml/min flow rate.
Keywords :
heat sinks; heat transfer; microchannel flow; CFX simulation; highly efficient manifold microchannel heatsink; local heat transfer; substrate steady-state temperature;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20071325
