DocumentCode
1115324
Title
Asymmetric Dielectric Trilayer Cantilever Probe for Calorimetric High-Frequency Field Imaging
Author
Lee, Simone ; Wallis, T. Mitch ; Moreland, John ; Kabos, Pavel ; Lee, Y.C.
Author_Institution
Colorado Univ., Boulder, CO
Volume
16
Issue
1
fYear
2007
Firstpage
78
Lastpage
86
Abstract
Multimaterial, microelectromechanical systems-based cantilever probes were developed for high-frequency magnetic field imaging. The basic configuration of the probe consists of a cantilever beam fabricated using surface micromachining and bulk micromachining techniques with dielectric silicon nitride and silicon oxide materials on a silicon wafer. A gold patterned metallization at the tip of the cantilever provides a source of eddy current heating due to the perpendicular component of the high-frequency magnetic field. This thermally absorbed power is converted to mechanical deflection by a multimaterial trilayer cantilever system. The deflection is measured with a beam-bounce optical technique employed in atomic force microscopy systems. We discuss the modeling, design, fabrication, and characterization of these field imaging probes
Keywords
atomic force microscopy; calorimetry; cantilevers; eddy current braking; magnetic sensors; microelectrodes; micromachining; microsensors; probes; MEMS cantilever; SiN; asymmetric dielectric; atomic force microscopy; beam-bounce optical technique; bulk micromachining; calorimetric high-frequency field imaging; eddy current heating; gold patterned metallization; mechanical deflection; microelectromechanical systems; multimaterial trilayer cantilever; radiofrequency probe; silicon oxide materials; silicon wafer; surface micromachining; trilayer cantilever probe; Atom optics; Atomic force microscopy; Atomic measurements; Dielectrics; Force measurement; Magnetic field measurement; Micromachining; Optical imaging; Probes; Silicon; Curvature; high-frequency imaging; microelectromechanical systems (MEMS) cantilever; radio-frequency (RF) probe;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2006.885849
Filename
4099368
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