Title :
Surface-related drain current dispersion effects in AlGaN-GaN HEMTs
Author :
Meneghesso, G. ; Verzellesi, Giovanni ; Pierobon, Roberto ; Rampazzo, Fabiana ; Chini, Alessandro ; Mishra, Umesh K. ; Canali, Claudio ; Zanoni, E.
Author_Institution :
Dept. of Inf. Eng. & INFM, Univ. of Padova, Italy
Abstract :
Drain current dispersion effects are investigated in AlGaN-GaN HEMTs by means of pulsed, transient, and small-signal measurements. Gate- and drain-lag effects characterized by time constants in the order of 10-5-10-4 s cause dispersion between dc and pulsed output characteristics when the gate or the drain voltage are pulsed. An activation energy of 0.3 eV is extracted from temperature-dependent gate-lag measurements. We show that two-dimensional numerical device simulations accounting only for polarization charges and donor-like traps at the ungated AlGaN surface can quantitatively reproduce all dispersion effects observed experimentally in the different pulsing modes, provided that the measured activation energy is adopted as the energetic distance of surface traps from the valence-band edge. Within this hypothesis, simulations show that surface traps behave as hole traps during transients, interacting with holes attracted at the AlGaN surface by the negative polarization charge.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; hole traps; semiconductor device models; AlGaN-GaN; HEMT; activation energy; current collapse; device simulation; donor-like traps; drain voltage; drain-lag effects; gate-lag effects; hole traps; negative polarization charge; polarization charges; pulsing modes; surface traps; surface-related drain current dispersion effects; temperature-dependent gate-lag measurements; two-dimensional numerical device simulations; ungated AlGaN surface; valence-band edge; Aluminum gallium nitride; Current measurement; Dispersion; Energy measurement; HEMTs; MODFETs; Polarization; Pulse measurements; Temperature measurement; Voltage; AlGaN–GaN HEMTs; current collapse; device simulation;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2004.835025